Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325874 | Device module having a plurality of dies electrically connected by posts | Chan H. Yoo, Szu-Ying Ho, John F. Kaeding | 2019-06-18 |
| 10192843 | Methods of making semiconductor device modules with increased yield | Chan H. Yoo, Szu-Ying Ho, John F. Kaeding | 2019-01-29 |