XL

Xuefeng Liu

IBM: 7 patents #778 of 11,143Top 7%
KL Kla-Tencor: 2 patents #103 of 446Top 25%
Overall (2019): #9,692 of 560,194Top 2%
9
Patents 2019

Issued Patents 2019

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
10504889 Integrating a junction field effect transistor into a vertical field effect transistor Brent A. Anderson, Huiming Bu, Terence B. Hook, Junli Wang 2019-12-10
10431646 Electronic devices having spiral conductive structures Peng Xu, Kangguo Cheng, Chi-Chun Liu, Yongan Xu 2019-10-01
10396179 Forming vertical transport field effect transistors with uniform bottom spacer thickness Kangguo Cheng, Peng Xu, Yongan Xu 2019-08-27
10388572 Integrating metal-insulator-metal capacitors with fabrication of vertical field effect transistors Kangguo Cheng, Heng Wu, Peng Xu 2019-08-20
10361285 Forming vertical transport field effect transistors with uniform bottom spacer thickness Kangguo Cheng, Peng Xu, Yongan Xu 2019-07-23
10325004 Method of optimizing an optical parametric model for structural analysis using optical critical dimension (OCD) metrology Thaddeus Gerard Dziura, Yung-Ho Alex Chuang, Bin-Ming Benjamin Tsai, John J. Hench 2019-06-18
10319852 Forming eDRAM unit cell with VFET and via capacitance Brent A. Anderson, Huiming Bu, Junli Wang 2019-06-11
10276558 Electrostatic discharge protection using vertical fin CMOS technology Brent A. Anderson, Huiming Bu, Terence B. Hook, Junli Wang, Miaomiao Wang 2019-04-30
10197501 Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors Yung-Ho Alex Chuang, John Fielden, David L. Brown 2019-02-05