Issued Patents 2019
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522406 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, Jeffrey D. Gelorme | 2019-12-31 |
| 10522383 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, Jeffrey D. Gelorme | 2019-12-31 |
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2019-11-26 |
| 10483215 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Jeffrey D. Gelorme, Li-Wen Hung | 2019-11-19 |
| 10448830 | Wearable blood pressure monitoring system | Hyung-Min Lee, Kang-Wook Lee | 2019-10-22 |
| 10393798 | Integrated electro-optical module assembly | Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more | 2019-08-27 |
| 10396220 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, Steven L. Wright, Cornelia Tsang Yang | 2019-08-27 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung | 2019-08-27 |
| 10383572 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2019-08-20 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, Cornelia K. Tsang | 2019-08-13 |
| 10380284 | Heterogeneous miniaturization platform | Qianwen Chen, Li-Wen Hung, Wanki Kim, Kenneth P. Rodbell, Robert L. Wisnieff | 2019-08-13 |
| 10361140 | Wafer stacking for integrated circuit manufacturing | Qianwen Chen, Bing Dang, Joana Sofia Branquinho Teresa Maria | 2019-07-23 |
| 10330701 | Test probe head for full wafer testing | Bing Dang, Yu Luo, Yang Liu, Steven L. Wright | 2019-06-25 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2019-06-18 |
| 10314970 | Drug delivery device having a cavity sealed by a pressurized membrane | Bing Dang, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright | 2019-06-11 |
| 10304802 | Integrated wafer-level processing system | Philip G. Emma, Hillery C. Hunter | 2019-05-28 |
| 10297479 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, Cornelia K. Tsang | 2019-05-21 |
| 10261067 | Method of forming a field effect based nanopore device | Effendi Leobandung | 2019-04-16 |
| 10258279 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2019-04-16 |
| 10258142 | Toothbrush with sensors | Minhua Lu, Sufi Zafar | 2019-04-16 |
| 10250963 | System for continuous monitoring of body sounds | Li-Wen Hung | 2019-04-02 |
| 10243091 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, Steven L. Wright, Cornelia Tsang Yang | 2019-03-26 |
| 10229288 | Enhanced data security platform | Bing Dang, Minhua Lu | 2019-03-12 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, Cornelia K. Tsang | 2019-03-05 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang | 2019-03-05 |