Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10383572 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Jae-Woong Nah | 2019-08-20 |
| 10258279 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Jae-Woong Nah | 2019-04-16 |