Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2019-11-26 |
| 10393962 | Optimized stand-offs and mechanical stops for precise three dimensional self-alignment | Tymon Barwicz, Yves Martin | 2019-08-27 |
| 10383572 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2019-08-20 |
| 10350713 | No clean flux composition and methods for use thereof | Victor Alvarez, Pierre Y. Beaulieu, Kang-Wook Lee, Lavanya Turlapati | 2019-07-16 |
| 10258279 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2019-04-16 |
| 10249559 | Ball grid array and land grid array assemblies fabricated using temporary resist | Charles L. Reynolds, Katsuyuki Sakuma | 2019-04-02 |