Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more | 2019-11-26 |
| 10488605 | Photonic waveguide coupling using offset light source | Marc A. Taubenblatt | 2019-11-26 |
| 10395929 | Chip handling and electronic component integration | Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-08-27 |
| 10393667 | Analysis using optical sensors and signal enhancing agents | Minhua Lu, Vince Siu, Evan G. Colgan | 2019-08-27 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2019-08-13 |
| 10353152 | Tapered photonic waveguide to optical fiber proximity coupler | — | 2019-07-16 |
| 10229898 | Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications | Mounir Meghelli, Jason S. Orcutt, Jean-Olivier Plouchart | 2019-03-12 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2019-03-05 |
| 10217637 | Chip handling and electronic component integration | Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-02-26 |
| 10166632 | In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method | Robert J. Polastre, Paul S. Andry | 2019-01-01 |
| 10168473 | Integration of bonded optoelectronics, photonics waveguide and VLSI SOI | Effendi Leobandung, Ning Li, Jean-Olivier Plouchart, Devendra K. Sadana | 2019-01-01 |