Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522406 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, John U. Knickerbocker | 2019-12-31 |
| 10522383 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, John U. Knickerbocker | 2019-12-31 |
| 10483215 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker | 2019-11-19 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-08-27 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet +5 more | 2019-07-30 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-06-18 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-03-05 |
| 10217637 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-02-26 |
| 10174229 | Adhesive resins for wafer bonding | Robert David Allen, Li-Wen Hung, Ratnam Sooriyakumaran, Linda Karin Sundberg | 2019-01-08 |
| 10168436 | Water soluble low alpha particle emission electrically-conductive coating | Michael A. Gaynes, Michael S. Gordon | 2019-01-01 |