Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10505160 | Micro-battery using glass package | Bing Dang, Yang Liu, Li-Wen Hung | 2019-12-10 |
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more | 2019-11-26 |
| 10407791 | Selective solder plating | Bing Dang, Yu Luo, Joana Sofia Branquinho Teresa Maria | 2019-09-10 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-08-27 |
| 10393798 | Integrated electro-optical module assembly | Paul S. Andry, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2019-08-27 |
| 10380284 | Heterogeneous miniaturization platform | Li-Wen Hung, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff | 2019-08-13 |
| 10361140 | Wafer stacking for integrated circuit manufacturing | Bing Dang, John U. Knickerbocker, Joana Sofia Branquinho Teresa Maria | 2019-07-23 |
| 10217637 | Chip handling and electronic component integration | Russell A. Budd, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2019-02-26 |