Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10338024 | Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures | Timothy J. Chainer, Edward J. Yarmchuk | 2019-07-02 |
| 10249516 | Underfill dispensing using funnels | Evan G. Colgan, Katsuyuki Sakuma, Donald A. Merte | 2019-04-02 |
| 10194522 | Thermal interface solution with reduced adhesion force | Timothy J. Chainer | 2019-01-29 |
| 10168436 | Water soluble low alpha particle emission electrically-conductive coating | Jeffrey D. Gelorme, Michael S. Gordon | 2019-01-01 |