Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-08-13 |
| 10347588 | Thin 3D die with electromagnetic radiation blocking encapsulation | Paul S. Andry, Adam Toner | 2019-07-09 |
| 10297479 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, John U. Knickerbocker | 2019-05-21 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-03-05 |
| 10177116 | Large channel interconnects with through silicon vias (TSVs) and method for constructing the same | Paul S. Andry, Mark D. Schultz | 2019-01-08 |