Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522639 | Methods, apparatus and system for stringer defect reduction in a trench cut region of a finFET device | Hui Zang, Daniel Jaeger, Haigou Huang, Veeraraghavan S. Basker, Christopher Nassar +1 more | 2019-12-31 |
| 10483369 | Methods of forming replacement gate structures on transistor devices | Haigou Huang, Xusheng Wu | 2019-11-19 |
| 10460986 | Cap structure | Daniel Jaeger, Chih-Chiang Chang, Michael V. Aquilino, Patrick Carpenter, Junsic Hong +3 more | 2019-10-29 |
| 10418455 | Methods, apparatus and system for stringer defect reduction in a trench cut region of a finFET device | Hui Zang, Daniel Jaeger, Haigou Huang, Veeraraghavan S. Basker, Christopher Nassar +1 more | 2019-09-17 |
| 10388562 | Composite contact etch stop layer | Haigou Huang, Daniel Jaeger, Xusheng Wu | 2019-08-20 |
| 10340142 | Methods, apparatus and system for self-aligned metal hard masks | Daniel Jaeger, Michael V. Aquilino, Patrick Carpenter, Jiehui Shu, Pei Liu +1 more | 2019-07-02 |
| 10325819 | Methods, apparatus and system for providing a pre-RMG replacement metal contact for a finFET device | Daniel Jaeger, Michael V. Aquilino, Patrick Carpenter, Jessica Dechene, Huy Cao +2 more | 2019-06-18 |
| 10269654 | Methods, apparatus and system for replacement contact for a finFET device | Daniel Jaeger, Michael V. Aquilino, Patrick Carpenter, Jessica Dechene, Huy Cao +2 more | 2019-04-23 |
| 10256089 | Replacement contact cuts with an encapsulated low-K dielectric | Huy Cao, Haigou Huang, Tai Fong Chao | 2019-04-09 |
| 10204784 | Methods of forming features on integrated circuit products | Hui Zang, Haigou Huang | 2019-02-12 |
| 10204797 | Methods, apparatus, and system for reducing step height difference in semiconductor devices | Daniel Jaeger, Michael V. Aquilino, Patrick Carpenter, Junsic Hong, Jessica Dechene +1 more | 2019-02-12 |