Issued Patents 2018
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153250 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Stefano S. Oggioni, Gerd Schlottig | 2018-12-11 |
| 10132433 | Releasable, threadless conduit connector for liquid manifold | Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig | 2018-11-20 |
| 10107426 | Releasable, threadless conduit connector for liquid manifold | Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig | 2018-10-23 |
| 10098241 | Printed circuit board with edge soldering for high-density packages and assemblies | Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Joerg-Eric Sagmeister, Patricia M. Sagmeister +1 more | 2018-10-09 |
| 10091909 | Method and device for cooling a heat generating component | Urs Kloter, Ryan J. Linderman, Bruno Michel, Hugo E. Rothuizen, Reio Waelchli | 2018-10-02 |
| 10068839 | Circuitized substrate with electronic components mounted on transversal portion thereof | Sebastian Gerke, Stefano S. Oggioni | 2018-09-04 |
| 10041709 | Adsorption heat exchanger devices | Javier V. Goicochea, Bruno Michel, Patrick Ruch | 2018-08-07 |
| 10006571 | Releasable, threadless conduit connector for liquid manifold | Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig | 2018-06-26 |
| 10008474 | Dense assembly of laterally soldered, overmolded chip packages | Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Patricia M. Sagmeister, Martin Schmatz | 2018-06-26 |
| 9941250 | Chip stack structures that implement two-phase cooling with radial flow | Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2018-04-10 |
| 9941189 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2018-04-10 |
| 9905505 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2018-02-27 |
| 9905506 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2018-02-27 |
| 9880595 | Cooling device with nested chambers for computer hardware | Ingmar G. Meijer, Bruno Michel, Stephan Paredes, Gerd Schlottig | 2018-01-30 |