Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10132433 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Michael J. Ellsworth, Jr., Gerd Schlottig | 2018-11-20 |
| 10107426 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Michael J. Ellsworth, Jr., Gerd Schlottig | 2018-10-23 |
| 10090173 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Yi Pan, Hilton T. Toy, Jeffrey A. Zitz | 2018-10-02 |
| 10006571 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Michael J. Ellsworth, Jr., Gerd Schlottig | 2018-06-26 |
| 9941189 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2018-04-10 |
| 9941788 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2018-04-10 |
| 9941250 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2018-04-10 |