Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090173 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2018-10-02 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2018-09-25 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2018-08-14 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2018-04-17 |