Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128590 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Paul F. Fortier | 2018-11-13 |
| 10090173 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Evan G. Colgan, Yi Pan, Jeffrey A. Zitz | 2018-10-02 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2018-09-25 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2018-08-14 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Jeffrey A. Zitz | 2018-04-17 |