Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128590 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Paul F. Fortier, Hilton T. Toy | 2018-11-13 |
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2018-06-19 |
| 9947204 | Validation of mechanical connections | Alan F. Benner | 2018-04-17 |