Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Eric D. Perfecto | 2018-06-19 |
| 9875985 | Flip-chip bonder with induction coils and a heating element | Jae-Woong Nah, Sébastien S. Quesnel | 2018-01-23 |
| 9875986 | Micro-scrub process for fluxless micro-bump bonding | Thomas Weiss | 2018-01-23 |
| 9860996 | Selective area heating for 3D chip stack | Mario J. Interrante | 2018-01-02 |