| 9999124 |
Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
James A. Busby, Michael J. Fisher, Michael A. Gaynes, David C. Long |
2018-06-12 |
| 9913370 |
Tamper-proof electronic packages formed with stressed glass |
James A. Busby, Silvio Dragone, Michael J. Fisher, Michael A. Gaynes, David C. Long +2 more |
2018-03-06 |
| 9913362 |
Tamper-respondent assemblies with bond protection |
William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more |
2018-03-06 |
| 9913389 |
Tamper-respondent assembly with vent structure |
Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, James Edward Tersigni |
2018-03-06 |
| 9913416 |
Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
Michael J. Fisher, David C. Long, Michael T. Peets |
2018-03-06 |
| 9894749 |
Tamper-respondent assemblies with bond protection |
William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more |
2018-02-13 |
| 9877383 |
Tamper-respondent assemblies with enclosure-to-board protection |
William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher +3 more |
2018-01-23 |
| 9875986 |
Micro-scrub process for fluxless micro-bump bonding |
Katsuyuki Sakuma |
2018-01-23 |
