Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Paul A. Lauro | 2018-12-04 |
| 10130302 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2018-11-20 |
| 10079375 | Dual seal microbattery and method of making | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Jeffrey D. Gelorme, Adinath S. Narasgond, Bucknell C. Webb | 2018-09-18 |
| 10014274 | Optimized solder pads for microelectronic components | Tymon Barwicz, Yves Martin | 2018-07-03 |
| 9972556 | Metal cored solder decal structure and process | Peter A. Gruber | 2018-05-15 |
| 9953908 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Peter J. Sorce | 2018-04-24 |
| 9897627 | Test probe substrate | Bing Dang, John U. Knickerbocker, Robert E. Trzcinski, Cornelia K. Tsang | 2018-02-20 |
| 9875985 | Flip-chip bonder with induction coils and a heating element | Sébastien S. Quesnel, Katsuyuki Sakuma | 2018-01-23 |
| 9861313 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2018-01-09 |