Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Jae-Woong Nah | 2018-12-04 |
| 10026618 | Method for improving quality of spalled material layers | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more | 2018-07-17 |
| 10020418 | Simplified process for vertical LED manufacturing | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2018-07-10 |
| 9929313 | Protective capping layer for spalled gallium nitride | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2018-03-27 |
| 9918382 | Patterned metallization handle layer for controlled spalling | Turki bin Saud bin Mohammed Al-Saud, Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2018-03-13 |