| 10147694 |
Direct injection molded solder process for forming solder bumps on wafers |
Michael A. Gaynes, Paul A. Lauro, Jae-Woong Nah |
2018-12-04 |
| 10132836 |
Method of forming surface protrusions on an article and the article with the protrusions attached |
John U. Knickerbocker, Yang Liu, Maurice Mason, Lubomyr T. Romankiw |
2018-11-20 |
| 10115711 |
Vertical light emitting diode with magnetic back contact |
Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana |
2018-10-30 |
| 10103450 |
Integration of area efficient antennas for phased array or wafer scale array antenna applications |
Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce, Cornelia K. Tsang |
2018-10-16 |
| 10062622 |
Electrolytic seal |
Yu Luo |
2018-08-28 |
| 10056310 |
Electrolytic seal |
Yu Luo |
2018-08-21 |
| 10056672 |
Waveguide including first and second metal plates and having a slotted feed to waveguide transition disposed in the first metallic plate |
Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia |
2018-08-21 |
| 10038232 |
Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies |
Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia |
2018-07-31 |
| 10032943 |
Device layer thin-film transfer to thermally conductive substrate |
John U. Knickerbocker, Steven L. Wright, Cornelia Tsang Yang |
2018-07-24 |
| 10032973 |
Magnetically guided chiplet displacement |
Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana |
2018-07-24 |
| 10033081 |
Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board |
Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia |
2018-07-24 |
| 10002856 |
Micro-LED array transfer |
Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana |
2018-06-19 |
| 9947570 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang |
2018-04-17 |
| 9947567 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding |
Jeffrey D. Gelorme, John U. Knickerbocker |
2018-04-17 |
| 9937124 |
Microchip substance delivery devices having low-power electromechanical release mechanisms |
S. Jay Chey, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more |
2018-04-10 |
| 9935009 |
IR assisted fan-out wafer level packaging using silicon handler |
Jeffrey D. Gelorme, John U. Knickerbocker |
2018-04-03 |
| 9897627 |
Test probe substrate |
John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang |
2018-02-20 |
| 9893047 |
Manufacture of wafer—panel die package assembly technology |
John U. Knickerbocker |
2018-02-13 |
| 9872394 |
Substrate via filling |
Steven A. Cordes, Sung Kwon Kang, Yu Luo, Peter J. Sorce |
2018-01-16 |
| 9867932 |
Drug delivery device having a cavity sealed by a pressurized membrane |
John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright |
2018-01-16 |
| 9865569 |
Planarity-tolerant reworkable interconnect with integrated testing |
John U. Knickerbocker, Yang Liu, Yu Luo, Steven L. Wright |
2018-01-09 |
