Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103450 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce | 2018-10-16 |
| 10056337 | Thin 3D die with electromagnetic radiation blocking encapsulation | Paul S. Andry, Adam Toner | 2018-08-21 |
| 9941250 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong | 2018-04-10 |
| 9897627 | Test probe substrate | Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski | 2018-02-20 |