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In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method |
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| 10096802 |
Homogeneous solid metallic anode for thin film microbattery |
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Thin 3D die with electromagnetic radiation blocking encapsulation |
Cornelia K. Tsang, Adam Toner |
2018-08-21 |
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Methods of forming microelectronic smart tags |
Monty M. Denneau, John U. Knickerbocker, Robert L. Wisnieff |
2018-04-24 |
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Handler bonding and debonding for semiconductor dies |
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2018-04-17 |
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Three-D power converter in three distinct strata |
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2018-04-10 |
| 9876200 |
All-silicon hermetic package and processing for narrow, low-profile microbatteries |
Bucknell C. Webb, Cornelia Tsang Yang |
2018-01-23 |
