| 10130302 |
Via and trench filling using injection molded soldering |
Shriya Kumar, Jae-Woong Nah |
2018-11-20 |
$2,951,000 |
| 10132836 |
Method of forming surface protrusions on an article and the article with the protrusions attached |
Bing Dang, Yang Liu, Maurice Mason, Lubomyr T. Romankiw |
2018-11-20 |
$2,951,000 |
| 10108068 |
Liquid crystal lens with variable focal length |
Michael S. Gordon, Minhua Lu, Robert J. Polastre |
2018-10-23 |
$2,704,000 |
| 10101631 |
Liquid crystal lens with variable focal length |
Michael S. Gordon, Minhua Lu, Robert J. Polastre |
2018-10-16 |
$2,674,000 |
| 10098611 |
Wearable and non-wearable electronic stethoscopes and use of the digitized acoustic data for data analytics and healthcare |
Kang-Wook Lee |
2018-10-16 |
$2,674,000 |
| 10032943 |
Device layer thin-film transfer to thermally conductive substrate |
Bing Dang, Steven L. Wright, Cornelia Tsang Yang |
2018-07-24 |
$2,645,000 |
| 9953501 |
Methods of forming microelectronic smart tags |
Paul S. Andry, Monty M. Denneau, Robert L. Wisnieff |
2018-04-24 |
$2,845,000 |
| 9945836 |
Field effect based nanopore device |
Effendi Leobandung |
2018-04-17 |
$1,989,000 |
| 9947567 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding |
Bing Dang, Jeffrey D. Gelorme |
2018-04-17 |
$1,989,000 |
| 9947570 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang |
2018-04-17 |
$1,989,000 |
| 9941788 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff |
2018-04-10 |
$2,135,000 |
| 9941250 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang |
2018-04-10 |
$2,135,000 |
| 9937124 |
Microchip substance delivery devices having low-power electromechanical release mechanisms |
S. Jay Chey, Bing Dang, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more |
2018-04-10 |
$2,135,000 |
| 9935009 |
IR assisted fan-out wafer level packaging using silicon handler |
Bing Dang, Jeffrey D. Gelorme |
2018-04-03 |
$2,801,000 |
| 9900677 |
System for continuous monitoring of body sounds |
Li-Wen Hung |
2018-02-20 |
$3,618,000 |
| 9897627 |
Test probe substrate |
Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang |
2018-02-20 |
$3,618,000 |
| 9893047 |
Manufacture of wafer—panel die package assembly technology |
Bing Dang |
2018-02-13 |
$2,196,000 |
| 9867932 |
Drug delivery device having a cavity sealed by a pressurized membrane |
Bing Dang, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright |
2018-01-16 |
$4,196,000 |
| 9865569 |
Planarity-tolerant reworkable interconnect with integrated testing |
Bing Dang, Yang Liu, Yu Luo, Steven L. Wright |
2018-01-09 |
$3,907,000 |
| 9861313 |
Via and trench filling using injection molded soldering |
Shriya Kumar, Jae-Woong Nah |
2018-01-09 |
$3,907,000 |
