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Home › IR assisted fan-out wafer level packaging using silicon handler

IR assisted fan-out wafer level packaging using silicon handler

US Patent 9935009 · Granted Apr 3, 2018

Estimated economic value: $2,801,000 ⓘ

Assignee

IBM

Inventors

Bing Dang (140 patents)
Jeffrey D. Gelorme (112 patents)
John U. Knickerbocker (308 patents)

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