Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2018-06-19 |
| 9953900 | Transistor structures gated using a conductor-filled via or trench | John M. Safran, Sami Rosenblatt, Chandrasekharan Kothandaraman | 2018-04-24 |