Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153250 | Flip-chip electronic device with carrier having heat dissipation elements free of solder mask | Thomas J. Brunschwiler, Gerd Schlottig | 2018-12-11 |
| 10098241 | Printed circuit board with edge soldering for high-density packages and assemblies | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Joerg-Eric Sagmeister, Patricia M. Sagmeister +1 more | 2018-10-09 |
| 10068839 | Circuitized substrate with electronic components mounted on transversal portion thereof | Thomas J. Brunschwiler, Sebastian Gerke | 2018-09-04 |
| 10008081 | Electronic devices with individual security circuits | Silvio Dragone, Christoph Hagleitner | 2018-06-26 |
| 10008474 | Dense assembly of laterally soldered, overmolded chip packages | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Patricia M. Sagmeister, Martin Schmatz | 2018-06-26 |
| 9980385 | Discrete electronic device embedded in chip module | Andreas Huber, Harald Huels, Thomas Strach, Thomas-Michael Winkel | 2018-05-22 |