Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10098241 | Printed circuit board with edge soldering for high-density packages and assemblies | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Patricia M. Sagmeister +1 more | 2018-10-09 |