Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10098241 | Printed circuit board with edge soldering for high-density packages and assemblies | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Joerg-Eric Sagmeister +1 more | 2018-10-09 |
| 10008474 | Dense assembly of laterally soldered, overmolded chip packages | Thomas J. Brunschwiler, Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Martin Schmatz | 2018-06-26 |
| 9892050 | Multi-stage translation of prefetch requests | Florian A. Auernhammer | 2018-02-13 |