Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9905505 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2018-02-27 |
| 9905506 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Thomas J. Brunschwiler, Bruno Michel | 2018-02-27 |