Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163867 | Semiconductor package and manufacturing method thereof | Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2018-12-25 |
| 10108283 | Touch display apparatus | Ju Han Kim, Yong Chan Park, Seung Kyeom Kim | 2018-10-23 |
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2018-10-02 |
| 9984947 | Fingerprint sensor and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jae Sung Park, Se Hwan Hong | 2018-05-29 |
| 9947468 | Multilayer ceramic electronic component and manufacturing method thereof | Chang Hoon Kim, Doo Young Kim, Tae-Young Kim, Seok Hyun Yoon, Jae Yeol Choi +1 more | 2018-04-17 |
| 9935083 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi | 2018-04-03 |
| 9917063 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Byong Woo Cho, Cha Gyu Song | 2018-03-13 |