Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115692 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Yasumitsu Orii | 2018-10-30 |
| 10103118 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Takashi Hisada | 2018-10-16 |
| 10065324 | Conveying apparatus | Minoru Ohki, Koyo YAMAZAKI, Fumiki OGAWA | 2018-09-04 |
| 10062551 | Sputtering apparatus and substrate processing apparatus | Shigenori Ishihara, Kazuya Konaga, Hiroyuki Toya, Shintaro Suda, Yasushi Yasumatsu +3 more | 2018-08-28 |
| 10037967 | Injection molded solder bumping | Toyohiro Aoki, Takashi Hisada, Kuniaki Sueoka | 2018-07-31 |
| 10037958 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Takashi Hisada | 2018-07-31 |
| 9997339 | Sputtering apparatus and substrate processing apparatus | Shigenori Ishihara, Hiroyuki Toya, Yasushi Yasumatsu, Toshikazu Nakazawa, Shintaro Suda +2 more | 2018-06-12 |
| 9859241 | Method of forming a solder bump structure | Toyohiro Aoki, Takashi Hisada | 2018-01-02 |