Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115692 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2018-10-30 |
| 9941230 | Electrical connecting structure between a substrate and a semiconductor chip | Keiji Matsumoto, Keishi Okamoto, Kazushige Toriyama | 2018-04-10 |