Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141278 | Chip mounting structure | Akihiro Horibe, Keiji Matsumoto, Kazushige Toriyama | 2018-11-27 |
| 10109540 | Fabrication of sacrificial interposer test structure | Hiroyuki Mori | 2018-10-23 |
| 10090586 | Wireless communication device with joined semiconductors | Toyohiro Aoki, Noam Kaminski, Kazushige Toriyama | 2018-10-02 |
| 9967971 | Method of reducing warpage of an orgacnic substrate | Sayuri Hada, Hiroyuki Mori | 2018-05-08 |
| 9941230 | Electrical connecting structure between a substrate and a semiconductor chip | Keiji Matsumoto, Yasumitsu Orii, Kazushige Toriyama | 2018-04-10 |
| 9893031 | Chip mounting structure | Akihiro Horibe, Keiji Matsumoto, Kazushige Toriyama | 2018-02-13 |