Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115692 | Method of forming solder bumps | Takashi Hisada, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2018-10-30 |
| 10103118 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2018-10-16 |
| 10090586 | Wireless communication device with joined semiconductors | Noam Kaminski, Keishi Okamoto, Kazushige Toriyama | 2018-10-02 |
| 10037958 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2018-07-31 |
| 10037967 | Injection molded solder bumping | Takashi Hisada, Eiji Nakamura, Kuniaki Sueoka | 2018-07-31 |
| 9859241 | Method of forming a solder bump structure | Takashi Hisada, Eiji Nakamura | 2018-01-02 |