Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074583 | Circuit module and manufacturing method thereof | Akihiro Horibe, Sayuri Hada | 2018-09-11 |
| 10037967 | Injection molded solder bumping | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura | 2018-07-31 |