Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115692 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2018-10-30 |
| 10103118 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Eiji Nakamura | 2018-10-16 |
| 10037958 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Eiji Nakamura | 2018-07-31 |
| 10037967 | Injection molded solder bumping | Toyohiro Aoki, Eiji Nakamura, Kuniaki Sueoka | 2018-07-31 |
| 9989713 | Fluid control structure | Elaine Cyr, Paul F. Fortier, Patrick Jacques, Koji Masuda, Masao Tokunari | 2018-06-05 |
| 9957193 | Single glass panel for fire door and double glazed glass panel for fire door | Kazuyuki Suzuki, Sachiko Nishikawa, Takashi Yokota | 2018-05-01 |
| 9859241 | Method of forming a solder bump structure | Toyohiro Aoki, Eiji Nakamura | 2018-01-02 |