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Methods for depositing low K and low wet etch rate dielectric thin films |
Ning Li, Mark Saly, David Thompson, Mihaela Balseanu |
2018-12-04 |
| 10134581 |
Methods and apparatus for selective dry etch |
Ning Li, Mihaela Balseanu, Dongqing Yang, Anchuan Wang |
2018-11-20 |
| 10023958 |
Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors |
Victor Nguyen, Ning Li, Mihaela Balseanu, Mark Saly, David Thompson |
2018-07-17 |
| 9984868 |
PEALD of films comprising silicon nitride |
Victor Nguyen, Woong Jae Lee, Mihaela Balseanu, Derek R. Witty |
2018-05-29 |
| 9875888 |
High temperature silicon oxide atomic layer deposition technology |
Wenbo Yan, Cong Trinh, Ning Li, Victor Nguyen, Mihaela Balseanu +1 more |
2018-01-23 |
