Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10147599 | Methods for depositing low K and low wet etch rate dielectric thin films | Ning Li, David Thompson, Mihaela Balseanu, Li-Qun Xia | 2018-12-04 | $61,690,000 |
| 10096464 | Atomic layer deposition of high density silicon dioxide | — | 2018-10-09 | $16,738,000 |
| 10023958 | Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors | Victor Nguyen, Ning Li, Mihaela Balseanu, Li-Qun Xia, David Thompson | 2018-07-17 | $37,247,000 |
| 9957165 | Precursors suitable for high temperature atomic layer deposition of silicon-containing films | — | 2018-05-01 | $18,276,000 |
| 9911591 | Selective deposition of thin film dielectrics using surface blocking chemistry | David Thompson, Bhaskar Jyoti Bhuyan | 2018-03-06 | $32,877,000 |
| 9875888 | High temperature silicon oxide atomic layer deposition technology | Wenbo Yan, Cong Trinh, Ning Li, Victor Nguyen, Mihaela Balseanu +1 more | 2018-01-23 | $41,300,000 |