Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812318 | Low temperature molecular layer deposition of SiCON | Mark Saly, Lakmal C. Kalutarage | 2017-11-07 |
| 9799533 | Methods of etching films comprising transition metals | Jeffrey W. Anthis, Benjamin Schmiege | 2017-10-24 |
| 9799511 | Methods for depositing low k and low wet etch rate dielectric thin films | Ning Li, Mark Saly, Mihaela Balseanu, Li-Qun Xia | 2017-10-24 |
| 9721787 | Film deposition using tantalum precursors | Jeffrey W. Anthis | 2017-08-01 |
| 9716012 | Methods of selective layer deposition | Huixiong Dai, Patrick M. Martin, Timothy Michaelson, Kadthala Ramaya Narendrnath, Robert Jan Visser +2 more | 2017-07-25 |
| 9685325 | Carbon and/or nitrogen incorporation in silicon based films using silicon precursors with organic co-reactants by PE-ALD | Mark Saly, Jessica S. Kachian | 2017-06-20 |
| 9683287 | Deposition of films comprising aluminum alloys with high aluminum content | Srinivas Gandikota, Xinliang Lu, Wei V. Tang, Jing Zhou, Seshadri Ganguli +6 more | 2017-06-20 |
| 9643844 | Low temperature atomic layer deposition of films comprising SiCN or SiCON | — | 2017-05-09 |
| 9631278 | Metal silicide formation through an intermediate metal halogen compound | Bencherki Mebarki | 2017-04-25 |
| 9580799 | Nitrogen-containing ligands and their use in atomic layer deposition methods | Jeffrey W. Anthis | 2017-02-28 |