Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716012 | Methods of selective layer deposition | David Thompson, Huixiong Dai, Patrick M. Martin, Timothy Michaelson, Robert Jan Visser +2 more | 2017-07-25 |
| 9685356 | Substrate support assembly having metal bonded protective layer | Vijay D. Parkhe | 2017-06-20 |
| 9669653 | Electrostatic chuck refurbishment | Vijay D. Parkhe | 2017-06-06 |
| 9627231 | Methods for bonding substrates | Gangadhar Sheelavant, Monika Agarwal, Ashish Bhatnagar | 2017-04-18 |
| 9613846 | Pad design for electrostatic chuck surface | Govinda Raj, Cheng-Hsiung Tsai, Robert T. Hirahara, Manjunatha Koppa, Ross Marshall | 2017-04-04 |