Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9779950 | Ruthenium film forming method, film forming apparatus, and semiconductor device manufacturing method | — | 2017-10-03 |
| 9711449 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Takahiro Hakamata | 2017-07-18 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Manabu Oie, Fumitaka Amano, Steven P. Consiglio +3 more | 2017-03-28 |
| 9576850 | Method for manufacturing semiconductor device | Atsushi Gomi, Kenji Suzuki, Tatsuo Hatano, Yasushi Mizusawa | 2017-02-21 |
| 9540733 | Film forming method, film forming apparatus and recording medium | — | 2017-01-10 |