Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711449 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka | 2017-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711449 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka | 2017-07-18 |