Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711449 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Tadahiro Ishizaka, Takahiro Hakamata | 2017-07-18 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Fumitaka Amano +3 more | 2017-03-28 |