Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748174 | Three-dimensional memory device having multi-layer diffusion barrier stack and method of making thereof | — | 2017-08-29 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Steven P. Consiglio +3 more | 2017-03-28 |
| 9558962 | Substrate processing method | Kandabara Tapily | 2017-01-31 |