Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Fumitaka Amano +3 more | 2017-03-28 |