Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832856 | Circuit board | Myung Sam Kang, Young Gwan Ko | 2017-11-28 |
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae-Joo Hwang, Young Kun Jee, Sang-Uk Han | 2017-08-01 |
| 9699885 | Circuit board including heat dissipation structure | Myung Sam Kang, Young Gwan Ko, Min Jae Seong | 2017-07-04 |
| 9655229 | Circuit board | Myung Sam Kang, Young Gwan Ko | 2017-05-16 |
| 9589947 | Semiconductor packages and methods of manufacturing the same | Jihwan Hwang, Young Kun Jee, Jung-Hwan Kim, Kwang-chul Choi | 2017-03-07 |
| 9543276 | Chip-stacked semiconductor package | Young Kun Jee, Sun-kyoung Seo | 2017-01-10 |