Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Tae-Joo Hwang, Tae Hong Min, Young Kun Jee, Sang-Uk Han | 2017-08-01 |