Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818732 | Chip-on-film package and device assembly including the same | Jae-Min Jung, KwanJai Lee, KyongSoon Cho, Jeong-Kyu Ha | 2017-11-14 |
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Young Kun Jee | 2017-08-01 |
| 9620389 | Methods of fabricating tape film packages | Jeong-Kyu Ha, Youngshin Kwon, KwanJai Lee, Jae-Min Jung, KyongSoon Cho | 2017-04-11 |