Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae Hong Min, Young Kun Jee, Sang-Uk Han | 2017-08-01 |
| 9685400 | Semiconductor package and method of forming the same | Tae-Gyeong Chung, Eun-Chul Ahn | 2017-06-20 |